- 19 May 2005 -

$200m spend for 45nm photomasks

IBM Corp and Toppan Printing Co Ltd are agreed to jointly develop photomasks for next generation, 45nm semiconductor manufacturing processes. The two will develop a photomask process intended to enable early production of 45nm devices. Approximately $200m is expected to be invested by the two companies.

Work will be at IBM's plant in Burlington, Vermont, US, and evaluated at IBM's advanced 300mm semiconductor wafer production facility in East Fishkill, New York. As part of this development work, Toppan will assign engineers to work with IBM's mask development team in Burlington.

By combining their respective 65nm photomask manufacturing technologies, which have been developed, the two companies have set a goal of developing 45nm photomasks that will be ready for production around mid-2007, when industry demand is expected to gather momentum.

Toppan plans to transfer the JD manufacturing process from IBM's Burlington operation to its own plants, and establish its own production system to provide customers with 45nm photomasks for the early stages of commercialisation.