-Oct. 5, 2005-

Jazz next-gen RFCMOS hits 0.13 micron for advanced analog and RF SoC

At the 2005 FSA Conference, Jazz Semiconductor unveiled its latest
process design kits for its 0.13 micron RFCMOS process. Called the
CA13, it is described as an "innovative approach to enabling analog
system on chip integration".

Jazz says its 0.13 micron process platform is a low-cost alternative
for applications that do not require the expensive copper interconnect
of traditional 0.13 micron CMOS implementations for the back-end and
pairs low-power digital logic with high-performance analog and RF
circuitry.

"With our 0.13 micron process platform, we are serving analog and RF
companies that have an increasing need for low-power digital
integration with high-performance analog and RF circuitry," said Paul
Kempf, chief technology and strategy officer, Jazz Semiconductor. "The
CA13 process and its follow on SiGe BiCMOS version, SBC13, continue to
underscore our commitment to enable low-cost, highly integrated analog
and RF ICs for next-generation products."

"RF System on Chip integration for low-cost wireless is a critical
component of the growing portable and connected electronics markets.
Jazz Semiconductor's 0.13 micron process platform provides an
efficient option, enabling RF System on Chip integration," said Joanne
Itow, managing director, Semico Research. "The follow-on 0.13 micron
SiGe version will further enable circuit designers to achieve higher
levels of integration at higher speeds."

The Jazz 0.13 micron process technology is targeted for markets
including multi-standard TV tuners and integrated demodulators,
cellular and wireless LAN transceivers with digital power control
integration and virtually any other design requiring RF or analog
System on Chip integration.

The Newport Beach, VA, USA, based company Jazz Semiconductor has
focused on enabling the integration of key analog and RF functions by
using an aluminum metal interconnect scheme to deliver the same RF
performance and low power consumption of conventional 0.13 micron
technology while maintaining the lower cost and reduced complexity of
the familiar aluminum-based approach without requiring expensive
copper interconnect layers. The Jazz platform is further
differentiated by the addition of a triple well for RF isolation,
5.6fF/um2 MIM capacitors, varactors, low and high value precision
resistors, and thick metal inductors for improved RF and analog
performance.

The CA13 platform reuses key modules from Jazz's 0.35um and 0.18um
platforms, provides six layers of metal, and can include
high-performance modules such as SiGe NPNs, Vertical PNPs,
High-Voltage FETs and non-volatile memory. Designers can use the Jazz
0.13 micron process platform to integrate more high-density digital
content with existing products in parallel with scaling the analog
portion of the chip at 0.35um, 0.25um or 0.18um process nodes. The
CA13 platform is the company's third generation of modular process
technology, which allows circuit designers the flexibility to choose
which process features will best differentiate their products by
optimizing design performance, manufacturing cycle time, and
ultimately, cost.

The roll-out of the CA13 platform precedes the release of the Jazz
SBC13 SiGe BiCMOS technology that is based upon the RFCMOS process.
The SBC13 technology includes a low-cost, 4 mask, SiGe bipolar NPN to
combine all of the features of CA13 with the performance advantages of
SiGe at low additional complexity. Design kits for SBC13 will be
available in the first quarter of 2006.