- 24 August 2006 -

Mattson scores its largest ever single order

Mattson Technology reckons it has received its largest order in its history. It comes from one of Taiwan's leading memory manufacturers the identity of which was not revealed. The systems include the Aspen III ICPHT strip and Helios rapid thermal processing (RTP) tools. Shipments begin in the current quarter and extend through the end of the year.
The systems will be used in the chipmaker's newest 300 mm fab for the production of DRAMs at the 90 nm technology node and below. This order marks the latest in the series of Mattson wins from major Taiwanese memory manufacturers, expanding the company's large installed base in the region and further reinforcing its leadership in the DRAM market.

"The order received for this chipmaker's new 300 mm fab for our Aspen III ICPHT and Helios systems represents one hundred percent of the manufacturer's strip and RTP requirements," said Ming C. Kao, Mattson Technology's Taiwan country manager. "Our customer values the proven performance of our systems, which are the tools of record in its other 300 mm fab as a result of their advanced processing capabilities, technology extendibility, high productivity and superior cost-of-ownership. We have been this leading DRAM chipmaker's vendor of choice over the past several years and look forward to continuing to be a partner our customer trusts to meet its aggressive manufacturing ramps."

Featuring Mattson's proprietary inductively coupled plasma (ICP) source technology, the Aspen III ICPHT provides increased throughput, improved process performance and reliability for front-end-of-line and back-end-of-line strip applications.

The Helios, which features an advanced model-based temperature control, addresses the most demanding RTP applications, delivering high productivity, excellent processing performance and superior cost-of-ownership (COO).

Just a few days before it had announced follow-on orders for its Aspen III ICPHT strip and Helios rapid thermal processing (RTP) systems from two major Taiwanese memory manufacturers. These will be used in their latest 300 mm fabs for the production of their advanced DRAMs through the 70 nm technology node. The systems, which will expand Mattson's large installed base in the region, began shipping in June of this year and will be completed by the first quarter of 2007.

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