- 20 July 2006 -

JPSA announces 300mm silicon wafer singulation capability

The new ChromaDice UV-DPSS laser systems from J.P. Sercel Associates can now scribe and dice 300mm (12") wafers, up to 500 microns thick. Other versions with short pulse UV lasers offer high speed, high yield processing of sapphire, silicon, and GaAs wafers, as well as other materials.

The UV laser process is a fast, low-stress method of singulation that minimizes chip breakage after cutting, for higher yields, and generates minimal debris. The UV singulation process is vibration-free, unlike processing with a mechanical dicing saw.
Jeffrey P. Sercel, President, said "With this new, larger wafer handling capability, customers can realize high yields and high-speed processing as well as increased process efficiency. Our patented ChromaDice system will singulate wafers up to 500 microns thick, so we're not limited to thin wafers. Since there is little or no heat affected zone, cuts are clean and stress-free, for higher die count per wafer than traditional scribing methods, as well as greater than 99 percent yield for better economic payback."
JPSA ChromaDice systems feature high-performance, ultra-precise air bearing stages that provide higher speed and acceleration in addition to greater travel for up to 300mm wafers. The system is also available with either 355nm or 266nm high-power, short pulse UV lasers for high speed, high yield processing of sapphire, silicon, and GaAs wafers, as well as other materials. 300mm processing systems are available with complete wafer handling systems including cassette loading.

For more information, visit www.jpsalaser.com