- 12 June 2006 -

Scriber/Breaker suits difficult brittle materials

Grassau, Germany, based DynTest Technologies GmbH has launched its DM-8510, a system which has, it says, an improved separation process for electronics substrates. Moreover, the high precision Scriber/Breaker is the first product of a new family of separation systems that has been primarily designed for III-V wafers and ceramic substrates, which are very brittle and difficult to separate into individual chips/dies.
The new semi-automated system offers a wider range of parameters for the separation process, as well as higher stage accuracy and repeatability. The semi-automated diamond Scribe/Break system can separate as standard version, wafers up to 150mm diameter, which covers 100% of the today's III-V wafer production. Passive temperature compensation enhances the repeatability of the complete scribe and break process.
Features of the DM-8510 system include encoder-controlled air bearing stage for accurate and repetitive positioning, force feedback controlled scribe module to apply even scribe force across the wafer independent of any wafer warpage. Also it has individual adjustable break baker to optimize the break process and a high resolution imaging system enhances position accuracy and repeatability.

The Model DM-8510 is based on a modular concept, optional available for 200 mm wafers and is also prepared to adopt an automated “cassette-to-cassette” handling system. Depending on the application various system configurations can be realised. The system allows high motion speed with individual separation steps, which means higher production throughput. With better yields and fewer operator interventions, the system helps the manufacturer to cut down manufacturing costs. Air bearings with the major motion parts fit very well with clean room applications and further reduce the maintenance effort.

For more details, visit: www.dyntest.de