III-Vs Review

Ultratech, Inc., introduced two new advanced-packaging (AP) lithography tools built on the company's highly successful Unity Platform. Leveraging its industry expertise and market-leading AP platform, Ultratech developed the new 200mm Unity GOLD and 300mm Unity PLATINUM lithography systems to deliver cost-effective solutions for foundry customers.

These low-risk manufacturing solutions provide the cost-of-ownership (CoO), operational flexibility and technical performance essential for Ultratech's global customers.

Ultratech Chairman and CEO Arthur W. Zafiropoulo explained, "As chips become more pervasive, there is a greater focus on the economics of global manufacturing. Our newest Unity tools were developed to be key enablers in providing the best cost-effective solutions for our global customers. We are proud of the strength of our customer relationships as it allows us to gain insight into their challenges and emerging requirements. As the advanced-packaging lithography leaders, we will continue to leverage our industry experience to create customized, low-risk solutions, meeting our global customers' changing technology and economic needs with a broad and flexible portfolio of product offerings."

Ultratech's new products, built on the customizable Unity Platform, represent a tangible solution to address market conditions witnessed by the leading wafer foundry customers. Unity GOLD provides 150- and 200mm wafer packaging solutions for flat panel display (FPD) applications, while the Unity PLATINUM lithography system provides 200- and 300mm wafer processing capabilities for high-volume chip manufacturing.

www.ultratech.com