- 5 June 2006 -

MicroTEC offers new chip-cooling heat pipes solution

Duisburg, Germany, based MicroTEC has developed a new solution for microelectronic heat dissipation. Miniaturization of classic heat pipe technology combined with the Duisburg-based company's patented manufacturing process allows chip constellations to be mounted in a tiny space and, at the same time, for the heat of individual chips to be dissipated through the use of cooling pipes.

Thermal management is a major engineering headache for a wide range of electronic devices. The obvious problems of miniaturisation in cellphones and laptops are but one example. No less important are requirements for extracting excessive heat from such optoelectronic devices as high power diode lasers.

Micro heat pipes are devices that produce a cooling effect through the combined use of microfluid technology, evaporation and condensation in a closed fluid system.
The microTEC process is the first solution that allows all three spatial directions to be used for efficient cooling at a low cost and simple manner.

These technologies will pave the way for new solutions in areas such as high performance computers and mobile devices, whose trend toward increased performance requirements and reduced component size makes integrated chip cooling an absolute necessity.
Founded in Germany in 1996, microTEC Gesellschaft fur Mikrotechnologie mbH specializes in industrial microtechnology and nanotechnology applications. The company's products include customer specific microfluid systems for diagnostics, micro-gear drives, micropumps and solutions for highly integrated microelectronics.

http://www.microtec-d.com