- 06th November 2006

Cree’s First Power Switch and Diode Co-Pack

Cree, Inc., is sampling its first power-device combination pack (co-pack). The new Cree co-pack solution is designed specifically to reduce costs and increase efficiency of inverters used in solar, UPS and motor-drive power applications.

The new Cree CID150660 co-pack features a 6A/600V Cree SiC Schottky diode combined with a 15A silicon insulated gate bipolar transistor (IGBT) from International Rectifier. It is available in an industry-standard TO-220-3 package.

“Cree’s new co-pack provides inverter designers with the potential to achieve new levels of efficiency at power levels up to 3 kW,” said Stuart Hodge, Cree manager of applications engineering for power devices.

“This is the first in a series of co-pack products targeted to reduce IGBT switching losses up to 50% and reduce overall inverter losses up to 25%. When compared with traditional silicon-based pn diodes, Cree’s SiC-based Schottky diodes and co-pack solutions provide lower switching losses, higher frequency operation, and higher power densities.”

Web: www.cree.com