- 25 September 2006 -

Microsemi Miniaturizes Power Amplifier for Wireless LAN

Microsemi Corporation's newest 2.4GHz wireless LAN power amplifier comes in the smallest package available for 802.11b/g/n WiFi client and access point applications, it claims. This should impress designers hoping to save on circuit board area without compromising on performance or manufacturability especially for WiFi front-end modules and VoIP handheld applications.

It has been some time since Microsemi launched new InGaP MMIC products. A few months ago at IEEE MTT-S International Symposium it showcased some new chips as part of its expanding RF power products line. It made a key strategic acquisition early in the year by adding Advanced Power Technology which gave it SiC technology. However, this will likely better suit higher power applications (as well as defence/aerospace end-user markets, etc.) while it is aiming its HBT InGaP power amplifiers into the volume markets of IEEE 802.11a/b/g wireless LAN applications such as handset VOIP.

Until the latest announcement, Microsemi's newest InGaP HBT power amplifiers included the LX5506M and LX5530 which are for broadband, high-gain power amplification in 802.11a applications and the LX5511 and LX5513 for high gain 802.11b/g applications.

Dual-mode handsets are made by Motorola, Cisco, Samsung, LG and others. First VoIP handsets were all USB-based, but now it is all about cordless, Bluetooth and WiFi. Handset OEMs world over are buying into the potentially huge market for so-called 'fixed-mobile convergence' (FMC) technology. ABI Research predicts worldwide shipments of dual-mode, i.e. cellular and VoIP-over-WiFi handsets will exceed 300 million during 2011. The future is by no means assured - ABI warns that the arrival of so-called 'femtocell access points' i.e. small cellular base-stations for use in residential or corporate environments may act so as to disrupt the market later on. Using femtocell access points you will be able to wirelessly utilize home broadband connection for voice. Good news for Microsemi et al., ABI says most of the 300 million dual-mode handsets it predicts are coming along will be based on 802.11n.
Designated the LX5514, the new miniature amplifier's 2x2mm footprint allows a 55% reduction in board space over first generation 3x3mm devices and provides performance equal to Microsemi's best-in-class, LX5511 power amplifier. The LX5514 is a two-stage MMIC device manufactured in an advanced InGaP HBT process. With active bias and output pre-matching it achieves a power gain of 28dB with a low quiescent current of 80mA. The LX5514 also provides a low EVM of 3% at 20dBm OFDM output power while consuming only 150mA of total DC current.

The LX5514 is Microsemi's latest 2.4GHz power amplifier solution into the fast growing 802.11b/g/n WiFi marketplace. In addition to its space-saving footprint, the LX5514's design includes an integrated power detect function that not only saves board space but also reduces total BOM cost. At an ultra thin 0.46mm height, the LX5514 is ideally suited for WiFi front-end modules and VoIP handheld applications.

"The wireless appliance market continues to be a focus for us," said Paul Bibeau, Sr. VP and GM of Microsemi's Integrated Products Group. "The development of the LX5514 power amplifier leverages our proven technological and manufacturing expertise."

The company adds that a smaller package allows designers the freedom and flexibility to design a low cost discrete RF power amplifier stage in the smallest form factors retaining simple automated assembly techniques offered by the 2x2mm 12-pin MLP surface mount package.

The LX5514 power amplifier is available for immediate sampling. In 10K lot quantities, the unit price is $0.47.

Finally, Microsemi recently updated its fourth quarter guidance saying it expects Q4 revenues for FY2006 to be flat to up 2% compared to revenues of Q3 2006 - this was due to the weakness in the market even though order rates were strong.

www.microsemi.com



An example of one of the newest VOIP handsets - Paragon Wireless' dual-mode smartphone, the hipi-2200 is ultra slim and the world’s first SIP-based Windows Mobile 5.0 dual-mode handset with VoWLAN/GSM technology. It claims to be very user-friendly for the switch between VoIP and cell networks. On many people's Xmas list, it has a 2MP camera 176x220 pixel display, plays MP3/MP4, is a camcorder/recorder – all with 4 hours of talk time, 200 hours standby with GSM and Wi-Fi working together.

Visit: www.parawireless.com/